Microelectronic package including a polymer encapsulated die
DC
First Claim
1. A microelectronic package comprising:
- a carrier substrate that includes a die attachment face and carrier sides about the die attachment face, said die attachment face comprising a die attach region and a surrounding region about the die attach region;
an integrated circuit die overlying the die attach region and spaced apart therefrom by a gap, said integrated circuit die including an active face facing the die attach region and a back face opposite the active face;
a plurality of solder bump interconnections that extend across the gap and connect the integrated circuit die to the die attach region; and
an encapsulant formed of a singular polymeric body overlying the back face and molded against the surrounding region so as to encapsulate the die therein, said body comprising sides coextensive with said carrier sides.
19 Assignments
Litigations
0 Petitions
Accused Products
Abstract
A microelectronic package (10) is formed and includes an integrated circuit die (12) attached to a substrate (14) by a plurality of solder bump interconnections (16) to form a preassembly (18). The integrated circuit die (12) has an active face (20) that faces the substrate (14) and is spaced apart therefrom by a gap (22). The integrated circuit die (12) also includes a back face (24) opposite the active face (20). The substrate (14) includes a die attach region (26) and a surrounding region (28) about the integrated circuit die (12). The solder bump interconnections (16) extend across the gap (22) and connect the integrated circuit die (12) and the substrate (14). A mold (30) is disposed about the preassembly (18) such that the mold (30) cooperates with the substrate (14) to define a mold cavity (32) that encloses the integrated circuit die (12). The mold (30) has a molding surface (34) that includes the surrounding region (28) and a mold surface (34) that faces the back face (24) and is spaced apart therefrom. A polymeric precursor (36) is dispensed into the mold cavity (32) and is formed against the molding surface (34) and the back face (24). The polymeric precursor (36) is then cured to form a polymeric encapsulant (38) that encapsulates the integrated circuit die (12).
121 Citations
5 Claims
-
1. A microelectronic package comprising:
-
a carrier substrate that includes a die attachment face and carrier sides about the die attachment face, said die attachment face comprising a die attach region and a surrounding region about the die attach region; an integrated circuit die overlying the die attach region and spaced apart therefrom by a gap, said integrated circuit die including an active face facing the die attach region and a back face opposite the active face; a plurality of solder bump interconnections that extend across the gap and connect the integrated circuit die to the die attach region; and an encapsulant formed of a singular polymeric body overlying the back face and molded against the surrounding region so as to encapsulate the die therein, said body comprising sides coextensive with said carrier sides. - View Dependent Claims (2, 3, 4)
-
-
5. A microelectronic package comprising:
-
a carrier substrate that includes a die attachment face, carrier sides perpendicular to the die attachment face, a substrate back side opposite the die attachment face, and a plurality of package bond pads located on the substrate back side, said die attachment face comprising a die attach region and a surrounding region about the die attach region; an integrated circuit die overlying the die attach region and spaced apart therefrom by a gap, said integrated circuit die including an active face facing the die attach region and a back face opposite the active face; a plurality of solder bump interconnections that extend across the gap and connect the integrated circuit die to the die attach region; an encapsulant formed of a singular polymeric body overlying the back face and molded against the surrounding region so as to encapsulate the die therein, said body comprising sides coextensive with said sides; and a plurality of solder bumps attached to the package bond pads on the substrate back side of the substrate.
-
Specification
-
- Resources
-
Current AssigneeNorth Star Innovations Inc. (Wi-LAN Inc.)
-
Original AssigneeMotorola, Inc. (Motorola Solutions, Inc.)
-
InventorsCarney, Francis J., Carson, George Amos, Celaya, Phillip C., Fuerhaupter, Harry, Jones, Frank Tim, Klosterman, Donald H., Melton, Cynthia M., Knapp, James Howard, Nelson, Keith E.
-
Primary Examiner(s)HARDY, DAVID B
-
Application NumberUS09/304,152Time in Patent Office449 DaysField of Search257/778, 257/790, 257/738US Class Current257/790CPC Class CodesH01L 21/561 Batch processingH01L 21/565 MouldsH01L 2224/05568 the whole external layer pr...H01L 2224/05573 Single external layerH01L 2224/05599 MaterialH01L 2224/16 of an individual bump conne...H01L 2224/16225 the item being non-metallic...H01L 2224/16227 the bump connector connecti...H01L 2224/16235 the bump connector connecti...H01L 2224/81 using a bump connectorH01L 2224/97 the devices being connected...H01L 23/3121 a substrate forming part of...H01L 23/315 the encapsulation having a ...H01L 24/97 the devices being connected...H01L 2924/00 Indexing scheme for arrange...H01L 2924/00014 the subject-matter covered ...H01L 2924/01006 Carbon [C]H01L 2924/01013 Aluminum [Al]H01L 2924/01029 Copper [Cu]H01L 2924/01033 Arsenic [As]View All
