Heatspreader for a flip chip device, and method for connecting the heatspreader
DC
First Claim
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1. A circuit assembly, comprising:
- a substrate having a plurality of terminal pads;
an integrated circuit device having first and second faces, the first face having a plurality of electrical interconnections to the terminal pads in the substrate; and
a heatspreader plate having a plurality of legs, the second face of the integrated circuit device connected to the heatspreader plate by a first thermal interface material, each of the plurality of legs connected to the substrate by a second thermal interface material,wherein a shortest distance between any two of the plurality of legs is sufficiently large to allow ingress and egress of liquids and gases.
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Abstract
A circuit board assembly includes an integrated circuit package. A first substrate has first and second surfaces. Each surface of the first substrate has a plurality of terminal pads. An integrated circuit device has first and second faces. The first face has a plurality of electrical interconnections to the terminal pads in the first surface of the first substrate. A heatspreader plate has a plurality of legs. For example, the heatspreader may be shaped like a table with four legs. The heatspreader may be formed of copper. The second face of the integrated circuit device is connected to the heatspreader plate by a first thermal interface material. Each of the plurality of legs is connected to the first surface of the first substrate by a second thermal interface material. The first and second thermal interface materials may both be, for example, a conductive silver-filled epoxy. The heatspreader provides an open package that is easily cleaned and drained. A second substrate (which may be a motherboard, system board, or other printed circuit board) has a plurality of terminal pads. The terminal pads of the second substrate are connected to the terminal pads of the second surface of the first substrate. In an alternative (direct chip attach) configuration, the flip chip device and the heatspreader may be directly connected to a printed circuit board, which may be a motherboard or other system board.
84 Citations
19 Claims
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1. A circuit assembly, comprising:
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a substrate having a plurality of terminal pads; an integrated circuit device having first and second faces, the first face having a plurality of electrical interconnections to the terminal pads in the substrate; and a heatspreader plate having a plurality of legs, the second face of the integrated circuit device connected to the heatspreader plate by a first thermal interface material, each of the plurality of legs connected to the substrate by a second thermal interface material, wherein a shortest distance between any two of the plurality of legs is sufficiently large to allow ingress and egress of liquids and gases. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A circuit board assembly, comprising:
an integrated circuit package, comprising; a first substrate having first and second surfaces, each surface having a plurality of terminal pads, an integrated circuit device having first and second faces, the first face having a plurality of electrical interconnections to the terminal pads in the first surface of the first substrate, and a heatspreader plate having a plurality of legs, the second face of the integrated circuit device connected to the heatspreader plate by a first thermal interface material, each of the plurality of legs connected to the first surface of the first substrate by a second thermal interface material; and a second substrate having a plurality of terminal pads, the terminal pads of the second substrate being connected to the terminal pads of the second surface of the first substrate, wherein a shortest distance between any two of the plurality of legs is sufficiently large to allow ingress and egress of liquids and gases. - View Dependent Claims (9, 10, 11)
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12. A heatspreader,
said heatspreader having a flat heatspreader plate section, said heatspreader having at least four legs formed integrally from the same piece of material as the heatspreader plate section, each leg being stamped into the heatspreader proximate to a perimeter of the heatspreader, each leg having a bottom surface substantially parallel to the heatspreader plate section.
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16. A circuit assembly, comprising:
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an integrated circuit device having first and second faces, the first face having a plurality of electrical interconnections connectable to a plurality of terminal pads on a substrate; and a heatspreader plate having a plurality of legs, the second face of the integrated circuit device connected to the heatspreader plate by a first thermal interface material, each of the plurality of legs connectable to the substrate by a second thermal interface material, wherein a shortest distance between any two of the plurality of legs is sufficiently large to allow ingress and egress of liquids and gases when the legs interface with a substrate.
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17. A circuit assembly, comprising:
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a substrate having a plurality of terminal pads; an integrated circuit device having first and second faces, the first face having a plurality of electrical interconnections to the terminal pads in the substrate; and a heatspreader plate having at least four legs, the second face of the integrated circuit device connected to the heatspreader plate by a first thermal interface material, each leg connected to the substrate by a second thermal interface materials.
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18. A circuit board assembly, comprising:
an integrated circuit package, comprising; a first substrate having first and second surfaces, each surface having a plurality of terminal pads, an integrated circuit device having first and second faces, the first face having a plurality of electrical interconnections to the terminal pads in the first surface of the first substrate, and a heatspreader plate having at least four legs, the second face of the integrated circuit device connected to the heatspreader plate by a first thermal interface material, each of the plurality of legs connected to the first surface of the first substrate by a second thermal interface material; and a second substrate having a plurality of terminal pads, the terminal pads of the second substrate being connected to the terminal pads of the second surface of the first substrate.
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19. A heatspreader,
said heatspreader having a flat heatspreader plate section, said heatspreader having a plurality of legs formed integrally from the same piece of material as the heatspreader plate section, each leg being stamped into the heatspreader proximate to a perimeter of the heatspreader, each leg having a bottom surface substantially parallel to the heatspreader plate section, wherein a shortest distance between any two of the plurality of legs is sufficiently large to allow ingress and egress of liquids and gases.
Specification
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Litigation Data
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Current AssigneeBell Semiconductor, LLC (Hilco Inc. (d/b/a Hilco Global))
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Original AssigneeLucent Technologies, Inc. (Nokia Corporation)
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InventorsLischner, David, Nika, Raymond J., Ronemus, James Robert
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Primary Examiner(s)Hardy, David
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Assistant Examiner(s)CLARK, JASMINE JHIHAN B
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Application NumberUS09/193,832Time in Patent Office665 DaysField of Search257/706, 257/675, 257/778, 257/704, 257/783, 257/710, 257/678, 257/712-714, 257/717, 257/721, 361/687-690, 361/702US Class Current257/706CPC Class CodesH01L 2224/16225 the item being non-metallic...H01L 2224/32225 the item being non-metallic...H01L 2224/32245 the item being metallicH01L 2224/73204 the bump connector being em...H01L 2224/73253 Bump and layer connectorsH01L 23/36 Selection of materials, or ...H01L 2924/00012 Relevant to the scope of th...H01L 2924/15311 being a ball array, e.g. BGAH01L 2924/16251 Connecting to an item not b...Y10S 29/037 Stamping with other stepY10T 29/49133 with component orientingY10T 29/49135 and shaping, e.g., cutting ...Y10T 29/49144 by metal fusionY10T 29/49204 Contact or terminal manufac...
