×

Robust interconnect structure

DC
  • US 6,133,136 A
  • Filed: 05/19/1999
  • Issued: 10/17/2000
  • Est. Priority Date: 05/19/1999
  • Status: Expired due to Term
First Claim
Patent Images

1. A structure comprising layer of copper, a barrier layer, a layer of AlCu and a pad-limiting layer, wherein the layer of AlCu and barrier layer are interposed between the layer of copper and pad-limiting layer, and wherein the barrier layer is located between the layer of copper and the layer of AlCu.

View all claims
  • 5 Assignments
Timeline View
Assignment View
    ×
    ×