Robust interconnect structure
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1. A structure comprising layer of copper, a barrier layer, a layer of AlCu and a pad-limiting layer, wherein the layer of AlCu and barrier layer are interposed between the layer of copper and pad-limiting layer, and wherein the barrier layer is located between the layer of copper and the layer of AlCu.
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Abstract
A structure comprising a layer of copper, a barrier layer, a layer of AlCu, and a pad-limiting layer, wherein the layer of AlCu and barrier layer are interposed between the layer of copper and pad-limiting layer.
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- 1. A structure comprising layer of copper, a barrier layer, a layer of AlCu and a pad-limiting layer, wherein the layer of AlCu and barrier layer are interposed between the layer of copper and pad-limiting layer, and wherein the barrier layer is located between the layer of copper and the layer of AlCu.
- 11. An interconnect structure comprising a layer of copper, a layer of isolation located over the layer of copper and having a via to expose a portion of the layer of copper, a barrier layer located in the via and over the layer of copper, a layer of AlCu located in the via and over the barrier layer, and a pad limiting layer located over the layer of AlCu.
Specification