Method of attaching a die to a substrate
DC- US 6,798,074 B2
- Filed: 03/04/2002
- Issued: 09/28/2004
- Est. Priority Date: 03/04/2002
- Status: Expired due to Term
First Claim
Patent Images
1. A semiconductor device, comprising:
- a base carrier having a top side and a bottom side, the top side having a central area for receiving an integrated circuit die and a peripheral area;
an extended adhesive material layer disposed on the top side of the base carrier, the adhesive material layer covering the central area and a large portion of the peripheral area of the base carrier top surface, wherein the adhesive material extends beyond edges of the die a distance greater than about two times a thickness of the die; and
an integrated circuit die attached to the base carrier with the adhesive material layer at the central area.
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Abstract
A semiconductor device 30 includes a base carrier 32, an adhesive material layer 36 and an integrated circuit die 34. The base carrier 32 has a top side and a bottom side, the top side having a central area for receiving the die 34 and a peripheral area surrounding the central area. The adhesive material layer 36 is disposed on the top side of the base carrier in an “X” shaped pattern. The “X” shaped pattern includes two bisecting lines. The two bisecting lines extend well beyond the central area and into the peripheral area of the base carrier top surface. The die 34 is attached to the base carrier 32 with the adhesive material layer 36 at the central area. Even after attachment of the die 34, the adhesive material 36 extends well beyond the die 34 and the central area into the peripheral area.
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Citations
10 Claims
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1. A semiconductor device, comprising:
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a base carrier having a top side and a bottom side, the top side having a central area for receiving an integrated circuit die and a peripheral area;
an extended adhesive material layer disposed on the top side of the base carrier, the adhesive material layer covering the central area and a large portion of the peripheral area of the base carrier top surface, wherein the adhesive material extends beyond edges of the die a distance greater than about two times a thickness of the die; and
an integrated circuit die attached to the base carrier with the adhesive material layer at the central area. - View Dependent Claims (2, 3, 4)
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5. A semiconductor device, comprising:
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a base carrier having a top side and a bottom side, the top side having a central area tar receiving an integrated circuit die and a peripheral area;
an extended adhesive material layer disposed on the top side of the base carrier, wherein the adhesive material layer is dispensed on the top side of the base carrier in an “
X”
shaped pattern, the “
X”
shaped pattern including two bisecting lines, wherein the two bisecting lines extend beyond the central area and into the peripheral area of the base carrier top surface, wherein the adhesive material extends beyond edges of the die a distance greater than about two times a thickness of the die; and
an integrated circuit die attached to the base carrier with the adhesive material layer at the central area. - View Dependent Claims (6, 7, 8, 9, 10)
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Specification
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Litigation Data
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Current AssigneeNorth Star Innovations Inc. (Owlpoint IP Opportunities JVF LP)
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Original AssigneeMotorola, Inc. (Motorola Solutions, Inc.)
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InventorsChow, Wai Wong, Ho, Wai Keung, Cheng, Man Hon
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Primary Examiner(s)THAI, LUAN C
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Application NumberUS10/090,094
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Publication Number
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Time in Patent Office939 Days
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Field of Search257/676, 257/666, 257/782, 257/784, 257/787, 257/783
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US Class Current257/783
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CPC Class CodesH01L 2224/05599 MaterialH01L 2224/29015 comprising protrusions or i...H01L 2224/32245 the item being metallicH01L 2224/45015 being circularH01L 2224/45099 MaterialH01L 2224/48091 ArchedH01L 2224/48247 connecting the wire to a bo...H01L 2224/73265 Layer and wire connectorsH01L 2224/85399 MaterialH01L 23/49513 having bonding material bet...H01L 24/29 of an individual layer conn...H01L 24/32 of an individual layer conn...H01L 24/48 of an individual wire conne...H01L 2924/00 Indexing scheme for arrange...H01L 2924/00012 Relevant to the scope of th...H01L 2924/00014 the subject-matter covered ...H01L 2924/00015 the subject-matter covered ...H01L 2924/01067 Holmium [Ho]H01L 2924/01327 Intermediate phases, i.e. i...H01L 2924/10253 Silicon [Si]View All
