Integrated circuit comprising an auxiliary component, for example a passive component or a microelectromechanical system, placed above an electronic chip, and the corresponding fabrication process
DC
First Claim
1. A process for fabricating an integrated circuit comprising the production of an electronic chip and the production of at least one auxiliary component placed above the chip and of a protective cover which covers the auxiliary component, wherein the chip is produced from a first semiconductor substrate, in that the auxiliary component is produced from a second semiconductor substrate, separate from the first and in that the second substrate supporting the auxiliary component is made to adhere mutually to the first semiconductor substrate in an adhesion region lying outside a cavity containing the auxiliary component and extending into one or other of the two substrates or into both substrates, the second substrate then also forming the protective cover.
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Accused Products
Abstract
The fabrication of an integrated circuit includes a first phase of producing an electronic chip and a second phase of producing at least one auxiliary component placed above the chip and of producing a protective cover which covers the auxiliary component. The first phase of producing the chip is effected from a first semiconductor substrate and comprises the formation of a cavity lying in a chosen region of the chip and emerging at the upper surface of the chip. The second production phase includes the production of the auxiliary component from a second semiconductor substrate, separate from the first, and then the placement in the cavity of the auxiliary component supported by the second substrate and the mutual adhesion of the second substrate to the upper surface of the chip lying outside the cavity. The second substrate then also forms the protective cover.
27 Citations
15 Claims
- 1. A process for fabricating an integrated circuit comprising the production of an electronic chip and the production of at least one auxiliary component placed above the chip and of a protective cover which covers the auxiliary component, wherein the chip is produced from a first semiconductor substrate, in that the auxiliary component is produced from a second semiconductor substrate, separate from the first and in that the second substrate supporting the auxiliary component is made to adhere mutually to the first semiconductor substrate in an adhesion region lying outside a cavity containing the auxiliary component and extending into one or other of the two substrates or into both substrates, the second substrate then also forming the protective cover.
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5. A process for fabricating an integrated circuit comprising the production of an electronic chip and the production of at least one auxiliary component placed above the chip and of a protective cover which covers the auxiliary component, wherein the chip is produced from a first semiconductor substrate, in that the auxiliary component is produced from a second semiconductor substrate, separate from the first and in that the second substrate supporting the auxiliary component is made to adhere mutually to the first semiconductor substrate in an adhesion region lying outside a cavity containing the auxiliary component and extending into one or other of the two substrates or into both substrates, the second substrate then also forming the protective cover, wherein the adhesion step is effected by molecular bonding.
- 6. A process for fabricating an integrated circuit comprising the production of an electronic chip and the production of at least one auxiliary component placed above the chip and of a protective cover which covers the auxiliary component, wherein the chip is produced from a first semiconductor substrate, in that the auxiliary component is produced from a second semiconductor substrate, separate from the first and in that the second substrate supporting the auxiliary component is made to adhere mutually to the first semiconductor substrate in an adhesion region lying outside a cavity containing the auxiliary component and extending into one or other of the two substrates or into both substrates, the second substrate then also forming the protective cover, wherein the production of the auxiliary component comprises the formation on an initial substrate of an intermediate layer composed of at least one sublayer of a material that can be selectively removed with respect to the material forming the second substrate and with respect to the material forming the initial substrate, the formation of the second substrate on the intermediate layer and the formation of the auxiliary component on the second substrate, this auxiliary component projecting from the upper surface of the second substrate and in that the production of the protective cover comprises, after the upper surface of the chip lying outside the cavity has adhered to the corresponding facing portion of the surface of the second substrate, the removal of the sublayer and of the initial substrate.
- 9. A process for fabricating an integrated circuit comprising the production of an electronic chip and the production of at least one auxiliary component placed above the chip and of a protective cover which covers the auxiliary component, wherein the chip is produced from a first semiconductor substrate, in that the auxiliary component is produced from a second semiconductor substrate, separate from the first and in that the second substrate supporting the auxiliary component is made to adhere mutually to the first semiconductor substrate in an adhesion region lying outside a cavity containing the auxiliary component and extending into one or other of the two substrates or into both substrates, the second substrate then also forming the protective cover, wherein the production of the electronic chip comprises the production of first contact pads emerging at the upper surface of the chip inside the adhesion region, in that the production of the auxiliary component comprises the production of second contact pads within the adhesion region and in that, during the mutual adhesion, the second contact pads come into contact with the first contact pads.
Specification
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- Resources
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Current AssigneeSTMicroelectronics Incorporated (STMicroelectronics NV)
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Original AssigneeSTMicroelectronics SA (STMicroelectronics NV)
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InventorsTorres, Joaquin, Coronel, Philippe, Farcy, Alexis, Ancey, Pascal
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Primary Examiner(s)GHYKA, ALEXANDER G
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Application NumberUS10/308,482Publication NumberTime in Patent Office784 DaysField of Search438/48, 438/51, 438/455US Class Current438/48CPC Class CodesB29C 2043/5825 dimensions or shape, e.g. s...B81C 1/0023 Packaging together an elect...
