Dissipative ceramic bonding tool tip
DC
First Claim
1. A device comprising:
- a tip of a bonding tool having a dissipative material for use in wire bonding machines for connecting leads to integrated circuit bonding pads, wherein the tip has a static discharge time between 0.1 and 0.5 seconds.
2 Assignments
Litigations
2 Petitions
Accused Products
Abstract
Methods for making and using dissipative ceramic bonding tool tips for wire bonding electrical connections to bonding pads on integrated circuit chips and packages. The method of using the dissipative ceramic bonding tool tip includes dissipating charge while bonding to avoid damaging delicate electronic devices by a sudden surge of accumulated charge. The method of making the tool tip includes affecting its conductivity so that it conducts electricity at a rate sufficient to prevent charge buildup, but not sufficient to overload the device being bonded. For best results, a resistance in the tip assembly itself should range from 5×104 or 105 to 1012 ohms. In addition, the tips must also have specific mechanical properties to function satisfactorily.
61 Citations
3 Claims
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1. A device comprising:
a tip of a bonding tool having a dissipative material for use in wire bonding machines for connecting leads to integrated circuit bonding pads, wherein the tip has a static discharge time between 0.1 and 0.5 seconds.
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2. A device comprising:
a bonding tool tip having an electrically dissipative ceramic for use in capillary wedge-type wire bonding machines for connecting leads to integrated circuit bonding pads.
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3. A method of using a bonding tool tip, comprising:
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providing an electrically dissipative bonding tool tip;
bonding a material to a device;
allowing an essentially smooth current to dissipate to the device, the current being low enough so as not to damage said device being bonded and high enough to avoid a build up of charge that could discharge to the device being bonded and damage the device being bonded.
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Specification
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- Resources
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Current AssigneeAnza Technology, Inc.
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Original AssigneeMary L Reiber, Steven-Frederick Reiber
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InventorsReiber, Steven-Frederick, Reiber, Mary Louise
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Primary Examiner(s)EDMONDSON, LYNNE RENEE
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Application NumberUS10/650,169Publication NumberTime in Patent Office734 DaysField of Search228/1.1, 228/4.5, 228/6.1, 228/6.2, 228/180.5, 219/56.21, 219/56.22US Class Current228/4.5CPC Class CodesB23K 20/004 Wire weldingB23K 20/005 Capillary weldingB23K 20/025 Bonding tips thereforB23K 2101/32 WiresH01L 2224/45015 being circularH01L 2224/45144 Gold (Au) as principal cons...H01L 2224/48 of an individual wire conne...H01L 2224/78301 CapillaryH01L 2224/78302 ShapeH01L 2224/85205 Ultrasonic bondingH01L 2224/85238 using electric resistance w...H01L 24/45 of an individual wire conne...H01L 24/78 Apparatus for connecting wi...H01L 24/85 using a wire connector wire...H01L 2924/00 Indexing scheme for arrange...H01L 2924/00014 the subject-matter covered ...H01L 2924/00015 the subject-matter covered ...H01L 2924/01005 Boron [B]H01L 2924/01006 Carbon [C]H01L 2924/01007 Nitrogen [N]View All
