Stacked chip connection using stand off stitch bonding
DC CAFC
First Claim
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1. A wire bonded structure comprising:
- a first bonding area, a second bonding area and a third bonding area respectively provided on first, second, and third components;
a first wire bond between said first and said second bonding areas;
a second wire bond between said second and said third bonding areas, wherein a bump is at one end of each of said first and second wire bonds; and
at least one of said first and second wire bonds at said second bonding area being on top of the other of said first and second wire bond at said second bonding area, and wherein one of said bumps is formed on said second bonding area in electrical communication with said first and second wire bonds.
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Abstract
The present invention provides a structure, apparatus, and method for wire bonding in which a first wire bond is formed between first and second components, a second wire bond is formed between the second component and a third component such that the second wire bond is in electrical communication with the first wire bond, wherein the first and second wire bonds are connected to said first and second components, respectively, using ball bonding.
55 Citations
40 Claims
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1. A wire bonded structure comprising:
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a first bonding area, a second bonding area and a third bonding area respectively provided on first, second, and third components; a first wire bond between said first and said second bonding areas; a second wire bond between said second and said third bonding areas, wherein a bump is at one end of each of said first and second wire bonds; and at least one of said first and second wire bonds at said second bonding area being on top of the other of said first and second wire bond at said second bonding area, and wherein one of said bumps is formed on said second bonding area in electrical communication with said first and second wire bonds. - View Dependent Claims (2, 3, 4, 9, 10, 11, 12)
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5. A wire bonded structure comprising:
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a first bonding area, a second bonding area and a third bonding area respectively provided on first, second, and third components, wherein at least two of said first, second and third components are in the same plane; a first wire bond between said first and said second bonding areas; a second wire bond between said second and said third bonding areas, wherein a bump is at one end of each of said first and second wire bonds; and at least one of said first and second wire bonds at said second bonding area being on top of the other of said first and second wire bond at said second bonding area, and wherein one of said bumps is formed on said second bonding area in electrical communication with said first and second wire bonds.
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6. A wire bonded structure comprising:
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a first bonding area, a second bonding area and a third bonding area respectively provided on first, second, and third components wherein each of said first, second and third components are in the same plane; a first wire bond between said first and said second bonding areas; a second wire bond between said second and said third bonding areas, wherein a bump is at one end of each of said first and second wire bonds; and at least one of first and second wire bonds at said second bonding area being on top of the other of said first and second wire bond at said second bonding area.
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7. A wire bonded structure comprising:
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a first bonding area, a second bonding area and a third bonding area respectively provided on first, second, and third components, wherein said first component is a substrate and said second and third components are integrated circuit chips, and wherein said integrated circuit chips are stacked over said substrate; a first wire bond between said first and said second bonding areas; a second wire bond between said second and said third bonding areas, wherein a bump is at one end of each of said first and second wire bonds; and at least one of said first and second wire bonds at said second bonding area being on top of the other of said first and second wire bond at said second bonding area, and wherein one of said bumps is formed on said second bonding area in electrical communication with said first and second wire bonds.
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8. A wire bonded structure comprising:
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a first bonding area, a second bonding area and a third bonding area respectively provided on first, second, and third components; a first wire bond between said first and said second bonding areas; a second wire bond between said second and said third bonding areas, wherein a bump is at one end of each of said first and second wire bonds, and a ball bond is at the other end of each of said first and second wire bonds; and at least one of said first and second wire bonds at said second bonding area being on top of the other of said first and second wire bond at said second bonding area, and wherein one of said bumps is formed on said second bonding area in electrical communication with said first and second wire bonds.
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13. A wire bonded structure comprising:
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a substrate, a lower chip positioned over said substrate, and an upper chip positioned over said lower chip, each of said substrate, lower chip and upper chip having exposed bonding pads; a first wire bond formed from a bonding pad of said substrate to a bonding pad of said lower chip; a second wire bond formed from said bonding pad of said lower chip to a bonding pad of said upper chip and electrically connected to said first wire bond; and wherein said first wire bond and said second wire bond are configured such that an imaginary line drawn between endpoints of said first wire bond and an imaginary line drawn between endpoints of said second wire bond are not parallel. - View Dependent Claims (14, 15, 16)
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17. A wire bonded structure comprising:
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a first conductive bump on a first bonding surface; a first ball bond on a second bonding surface; a first wire bond extending from said first ball bond to said first conductive bump; a second conductive bump on a third bonding surface; a second ball bond on said first bonding surface in electrical communication with said first conductive bump; and a second wire bond between said second ball bond and said second conductive bump. - View Dependent Claims (18, 19, 20, 21, 22)
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23. A method of wire bonding, said method comprising:
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forming a first wire bond between first and second components; forming a second wire bond between said second component and a third component such that said second wire bond is in electrical communication with said first wire bond; and connecting said first wire bond on at least one end using a ball bond on top of a first conductive bump. - View Dependent Claims (24, 25, 26, 27, 28, 29, 30, 31, 32)
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33. A method of wire bonding comprising:
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forming a first conductive bump on a first surface; forming a first ball bond on a second surface; forming a first wire bond from said first ball bond to said first conductive bump; forming a second conductive bump on a third surface; forming a second ball bond on said first surface in electrical communication with said first conductive bump; and forming a second wire bond from said second ball bond to said second conductive bump. - View Dependent Claims (34, 35, 36, 37, 38, 39, 40)
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Specification
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Litigation Data
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Current AssigneeRound Rock Research LLC
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Original AssigneeMicron Technology, Inc.
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InventorsBowen, Neal M.
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Primary Examiner(s)EDMONDSON, LYNNE RENEE
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Application NumberUS10/002,175Publication NumberTime in Patent Office1,581 DaysField of Search228/180.5, 228/4.5, 219/56.21, 219/56.22, 297/40, 298/40, 257/777, 438/106, 438/108, 438/109US Class Current228/180.5CPC Class CodesB23K 20/007 Ball bondingH01L 2224/05554 being squareH01L 2224/05599 MaterialH01L 2224/32145 the bodies being stackedH01L 2224/45144 Gold (Au) as principal cons...H01L 2224/48091 ArchedH01L 2224/48137 the bodies being arranged n...H01L 2224/48145 the bodies being stackedH01L 2224/48147 with an intermediate bond, ...H01L 2224/48175 the item being metallicH01L 2224/48471 the other connecting portio...H01L 2224/48472 the other connecting portio...H01L 2224/48475 connected to auxiliary conn...H01L 2224/48599 Principal constituent of th...H01L 2224/4911 the connectors being bonded...H01L 2224/49171 Fan-out arrangementsH01L 2224/49175 Parallel arrangementsH01L 2224/78301 CapillaryH01L 2224/789 Means for monitoring the co...H01L 2224/85045 using a corona discharge, e...View All
