Flip chip bonding tool tip
DCFirst Claim
1. A flip chip bonding tool tip for use in flip chip bonding machines for connecting leads on integrated circuit banding pads, the flip chip bonding tool tip comprising a dissipative material, wherein the dissipative material has a resistance low enough to prevent a discharge of a charge to a device being bonded and high enough to avoid current flow large enough to damage the device being bonded, wherein the dissipative material comprises a doped semi-conductor formed in a conducting core and the conducting core comprises a cobalt-bonded tungsten carbide coated with titanium nitride carbide.
1 Assignment
Litigations
1 Petition
Accused Products
Abstract
A flip chip bonding tool tip comprising a dissipative material with a resistance low enough to prevent a discharge of a charge to a device being bonded and high enough to avoid current flow large enough to damage the device being bonded is disclosed. Methods for manufacturing a dissipative material for use in a flip chip bonding tool tip are further disclosed.
94 Citations
59 Claims
- 1. A flip chip bonding tool tip for use in flip chip bonding machines for connecting leads on integrated circuit banding pads, the flip chip bonding tool tip comprising a dissipative material, wherein the dissipative material has a resistance low enough to prevent a discharge of a charge to a device being bonded and high enough to avoid current flow large enough to damage the device being bonded, wherein the dissipative material comprises a doped semi-conductor formed in a conducting core and the conducting core comprises a cobalt-bonded tungsten carbide coated with titanium nitride carbide.
-
7. A method of manufacturing a dissipative material for use in a flip chip bonding tool tip, wherein the dissipative material has a resistance low enough to prevent a discharge of a charge to a device being bonded and high enough to avoid current flow large enough to damage the device being bonded comprising:
-
mixing particles of a composition appropriate for forming the dissipative material with solvents, dispersants, binders, and sintering aids to form a mixture; molding the mixture into at least one wedge; drying the at least one wedge; heating the dried at least one wedge to a temperature sufficient to remove the dispersants and binders; further heating the heated at least one wedge to a temperature to sinter the particles together into a solid structure with low porosity; and cooling the solid structure. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
-
-
25. A method of manufacturing a dissipative material for use in a flip chip bonding tool tip, wherein the dissipative material has a resistance low enough to prevent a discharge of a charge to a device being bonded and high enough to avoid current flow large enough to damage the device being bonded comprising:
-
mixing particles of a composition appropriate for forming the dissipative material with binders and sintering aids to form a mixture; pressing the mixture in a mold at a high enough temperature to cause consolidation and binding of the particles into a solid structure with low porosity; and removing the solid structure from the mold. - View Dependent Claims (26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40)
-
-
41. A method of manufacturing a dissipative material for use in a flip chip bonding tool tip, wherein the dissipative material has a resistance low enough to prevent a discharge of a charge to a device being bonded and high enough to avoid current flow large enough to damage the device being bonded comprising:
-
melting at least one metal of a composition appropriate for forming the dissipative material in a non-reactive crucible; casting the melted at least one metal into an ingot; rolling the ingot into a rolled ingot; extruding the rolled ingot into an extruded material; drawing the extruded material into a drawn material; and pressing the drawn material into a pressed material. - View Dependent Claims (42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52)
-
-
53. A method for using a flip chip bonding tool in microelectronic assembly, comprising:
-
providing a flip chip bonding machine capable of being equipped with a flip chip bonding tool; equipping the flip chip bonding machine with the flip chip bonding tool, wherein the flip chip bonding tool has a tip comprised of a dissipative material wherein the dissipative material has a resistance low enough to prevent a discharge of a charge to a device being bonded and high enough to avoid current flow large enough to damage the device being bonded; providing a bonding material that is thermally and electrically conductive; melting the bonding material so that it becomes substantially spherical in shape; and electrically connecting an at least one component to a substrate by means of the flip chip bonding tool tip pressing the substantially spherical-shaped bonding material against a chip bond pad, wherein the substantially spherical bonding material is pressed to form a conductive bump. - View Dependent Claims (54)
-
-
55. A method of using an electricaLy dissipative flip chip bonding tool lip, having a resistance in the range of 102 to 1012 ohms, comprising:
- providing the electrically dissipatite flip chip bonding tool tip;
bonding a material to a device;
establishing a potential between the electrically dissipative flip chip bonding tooltip and the device being bonded, wherein establishing the potential between the electrically dissipative flip chip bonding tool tip and the device being bonded comprises grounding leads on the device being bonded; and allowing an essentially smooth curient to dissipate to the device, the current being low enough so as not to damage the device being bonded and high enough to avoid a build up of charge that could discharge to the device being bonded and damage the device being bonded.
- providing the electrically dissipatite flip chip bonding tool tip;
-
56. A method of using an electrically dissipative flip chip bonding tool tip, having a resistance in the range of 102 to 1012 ohms, comprising:
-
providing the electrically dissipative flip chip bonding tool tip; placing the electrically dissipative flip chip bonding tool tip in electrical contact with a device being bonded, wherein wire is fed through a tubular channel in the electrically dissipative flip chip bonding tool tip prior to the electrically dissipative flip chip bonding tool tip having been placed in contact with the device being bonded; bonding a material to the device; and allowing an essentially smooth current to dissipate to the device, the current being low enough sc as not to damage the device being bonded and high enough to avoid a build up of charge that could discharge to the device being bonded and damage the device being bonded.
-
-
57. A method of using an electricaLy dissipative flip chip bonding tool tip, having a resistance in the range of 102 to 1012 ohms, comprising:
-
providing the electrically dissipative flip chip bonding tool tip; providing an electrical discharge al the electrically dissipative flip chip bonding tool tip to melt a bit of wire, forming the bit of wire into a bonding ball; bonding a material to a device using the bonding ball; and
allowing an essentially smooth current to dissipate to the device, the currentbeing low enough so as not to damage the device being bonded and high enough to avoid a build up of charge that could discharge to the device being bonded and damage the device being bonded. - View Dependent Claims (58, 59)
-
Specification