Microelectronics component with rigid interposer

US 20010048591A1
Filed: 01/26/2001
Published: 12/06/2001
Est. Priority Date: 11/25/1997
Status: Active Grant

First Claim

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1. A connection comprising:

a first interposer having first and second surfaces, a second interposer having top and bottom surfaces, said top surface being disposed under said second surface, wherein the second interposer is more flexible than the first interposer;

a plurality of conductive structures exposed at the first surface of the first interposer; and

a plurality of planar leads exposed at the bottom surface of the second interposer, wherein each of the planar leads is electrically connected to at least one of the conductive structures.

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Abstract

A connection component is provided. The connection component includes (1) a first interposer having a first surface to which a microelectronic may be mounted and a second surface opposite from the first surface, (2) a second interposer that is more flexible than the first interposer and that is disposed under the second surface of the rigid interposer, and (3) a plurality of conductive parts that may be positioned in the first and second interposers and that may be exposed at the first surface of the first interposer, a bottom surface of the second interposer, or both the first and bottom surfaces. The electrically conductive parts may include leads. A socket assembly or a microelectronic element such as semiconductor chip may be mounted onto the first surface of the rigid interposer. The connection component may be mounted onto a support substrate.

Citations

98 Claims

1. A connection comprising:
- a first interposer having first and second surfaces, a second interposer having top and bottom surfaces, said top surface being disposed under said second surface, wherein the second interposer is more flexible than the first interposer;
  
  a plurality of conductive structures exposed at the first surface of the first interposer; and
  
  a plurality of planar leads exposed at the bottom surface of the second interposer, wherein each of the planar leads is electrically connected to at least one of the conductive structures.
- View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 88, 89, 90, 91, 92, 93, 94)
- - 2. The connection component of claim 1, wherein said top surface is adjacent to said second surface.
  - 3. The connection component of claim 2, wherein at least one of the conductive structures includes a first portion that extends through the first interposer and a second portion that extends through the second interposer.
  - 4. The connection component of claim 3, wherein each of the conductive structures includes a first portion that extends through the first interposer and a second portion that extends through the second interposer.
  - 5. The connection component of claim 4, wherein each of said second portions is electrically connected to one of the planar leads.
  - 6. The connection component of claim 4, wherein said first and second portions extend through the first and second interposers along a common axis.
  - 7. The connection component of claim 4, wherein said first and second portions extend through the first and second interposers along different axes.
  - 8. The connection component of claim 7, wherein at least one conductive structure further includes an electrically conductive trace that electrically connects the first portion to the second portion of said at least one conductive structure.
  - 9. The connection component of claim 4, wherein each of the conductive structures further include an electrically conductive element that is exposed at the first surface of the first interposer and that is electrically connected to one of said first portions.
  - 10. The connection component of claim 4, wherein each planar lead includes a terminal end and a tip end, wherein each of the terminal ends is electrically connected to one of said second portions.
  - 11. The connection component of claim 2, wherein the planar leads are flexible.
  - 12. The connection component of claim 2, wherein the planar leads are curved.
  - 13. The connection component of claim 10 further comprising a plurality of joining units, wherein each of the joining units is electrically connected to one of said tip ends.
  - 14. The connection component of claim 1 further comprising:
    - a third interposer; and
      
      a fourth interposer, wherein the third interposer is disposed over the top surface of the second interposer and the fourth interposer, further wherein the fourth interposer is disposed over the third interposer, further wherein the second surface of the first interposer is disposed over the fourth interposer, and further wherein the second and fourth interposers are more flexible than the first and third interposers.
  - 15. The connection component of claim 14, wherein each of the conductive structures extends through the first, second, third and fourth interposers.
  - 16. The connection component of claim 15, wherein each of the conductive structures includes a first portion that extends through the first interposer and further includes an electrically conductive element that is exposed at the first surface of the first interposer and that is electrically connected to said first portion.
  - 17. The connection component of claim 16, wherein each of the conductive structures further includes a second portion that extends through the second interposer and that is electrically connected to the first portion of said conductive structure and to one of the planar leads.
  - 18. The connection component of claim 17, wherein each of the planar leads includes a terminal end and a tip end.
  - 19. The connection component of claim 18, wherein the terminal end of each planar lead is electrically connected to one of the second portions.
  - 20. The connection component of claim 18 further comprising a plurality of joining units, wherein each of the joining units is electrically connected to one of said tip ends.
  - 21. The connection component of claim 14, wherein the planar leads are curved.
  - 22. The connection component of claim 1, wherein the first interposer comprises a material selected from the group consisting of alumina, beryllia, silicon carbide, aluminum nitride, forsterite, mullite, silicon, glass/ceramic composite, polyester/fiberglass composite, polyimide/fiberglass composite, epoxy/fiberglass composite and BT.
  - 23. The microelectronic component of claim 1, wherein the second interposer comprises polyimide.
  - 88. A method of making a microelectronic component comprising:
    - providing a connection component as claimed in claim 10;
      
      providing a microelectronic element having a front surface and a plurality of contacts on the front surface;
      
      juxtaposing the microelectronic element with of the first surface of the first interposer, wherein the front surface of the microelectronic element faces away from the first surface of the first interposer; and
      
      electrically connecting each of the contacts with one of the electrically conductive elements by a wirebond.
  - 89. The method of claim 88, wherein the first surface of the first interposer includes a central region and a peripheral region surrounding the central region, and further wherein juxtaposing the microelectronic element includes adhering the microelectronic element to the central region.
  - 90. The method of claim 89, wherein the each of the electrically conductive elements includes a bonding terminal exposed in the peripheral region of the first interposer and electrically connected to one of the contacts by one of the wirebonds.
  - 91. The method of claim 88 further comprising:
    - providing a plurality of joining units; and
      
      electrically connecting each of the joining units to one of the tip ends.
  - 92. The method of claim 91, wherein providing the joining units includes:
    - providing at least one of the joining units below the microelectronic element.
  - 93. The method of claim 91, wherein at least one of the joining units is movable with respect to the microelectronic element.
  - 94. The method of claim 88, wherein providing the microelectronic element includes:
    - providing a semiconductor chip.

24. A connection component comprising:
- a first interposer having first and second surfaces;
  
  a second interposer having top and bottom surfaces, said top surface being disposed under the second surface of the first interposer, wherein the second interposer is more flexible than the first interposer; and
  
  a plurality of conductive structures, said conductive structures extending through the first and the second interposers, wherein the conductive structures are exposed at the first surface of the first interposer.

25. A microelectronic component comprising:
- a first microelectronic element having a front surface and a plurality of first contacts exposed at the front surface;
  
  a first interposer having first and second surfaces, said first surface being disposed under the first microelectronic element;
  
  a second interposer having top and bottom surfaces, said top surface being disposed under the second surface of the first interposer, wherein the second interposer is more flexible than the first interposer;
  
  a plurality of conductive structures, wherein each of the conductive structures is electrically connected to one of the first contacts; and
  
  a plurality of planar leads exposed at the bottom surface of the second interposer, wherein each of the planar leads is electrically connected to one of the conductive structures.
- View Dependent Claims (26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69)
- - 26. The microelectronic component of claim 25, wherein the second surface of the first interposer is adjacent to the top surface of the second interposer.
  - 27. The microelectronic component of claim 26, wherein the first surface of the first interposer is adjacent to the front surface of the first microelectronic element.
  - 28. The microelectronic component of claim 27, whereineach of the conductive structures comprises:
    - a first portion disposed in a first aperture of the first interposer and electrically connected to one of the first contacts; and
      
      a second portion disposed in a second aperture of the second interposer and electrically connected to one of the planar leads.
  - 29. The microelectronic component of claim 28, wherein at least one conductive structure further includes an electrically conductive trace that electrically connects the first portion to the second portion of said at least one conductive structure.
  - 30. The microelectronic component of claim 29, wherein each first portion comprises a conductive polymer, and further wherein each electrically conductive trace and each second portion comprise a metal.
  - 31. The connection component of claim 30, wherein the conductive polymer is conductive adhesive.
  - 32. The microelectronic component of claim 29, wherein each first portion comprises solder, and further wherein each electrically conductive trace and each second portion comprise a metal.
  - 33. The microelectronic component of claim 28, wherein each planar lead includes a terminal end and a tip end, wherein one of the terminal ends is electrically connected to one of the second portions.
  - 34. The microelectronic component of claim 33, wherein the planar leads are curved.
  - 35. The microelectronic component of claim 33, wherein at least one of the tip ends is movable with respect to the first microelectronic element.
  - 36. The microelectronic component of claim 33 further comprising a plurality of joining units, wherein each of the joining units is electrically connected to one of the tip ends.
  - 37. The microelectronic component of claim 36, wherein at least one of the joining units is disposed below the first microelectronic element.
  - 38. The microelectronic component of claim 36, wherein the joining units are solder balls.
  - 39. The microelectronic component of claim 36, wherein at least one joining unit is movable with respect to the first microelectronic element.
  - 40. The microelectronic component of claim 26, wherein the first surface of the first interposer includes a central region and a peripheral region surrounding the central region, further wherein the first microelectronic element is disposed over the central region, and further wherein the front surface of the first microelectronic element faces away from the first surface of the first interposer.
  - 41. The microelectronic component of claim 40, wherein each of the conductive structures includes a first portion that extends through the first interposer and a second portion that extends through the second interposer.
  - 42. The microelectronic component of claim 41, wherein said first and second portions extend through the first and second interposers along a common axis.
  - 43. The microelectronic component of claim 41, wherein said first and second portions extend through the first and second interposers along different axes.
  - 44. The microelectronic component of claim 43, wherein said first and second portions are electrically connected by an electrically conductive trace.
  - 45. The microelectronic component of claim 41, wherein each of the conductive structures further includes an electrically conductive element that is exposed at the first surface of the first interposer and that is electrically connected to one of the first portions.
  - 46. The microelectronic component of claim 45, wherein each of the electrically conductive elements has a bonding terminal that is disposed in the peripheral region of the first surface and that is electrically connected to one of the first contacts by a wirebond.
  - 47. The microelectronic component of claim 46, wherein each wirebond extends downwardly from one of the first contacts to one of the bonding terminals.
  - 48. The microelectronic component of claim 46, wherein the first and second portions, the electrically conductive traces and the electrically conductive elements comprise a metal.
  - 49. The microelectronic component of claim 40, wherein each planar lead includes a terminal end and a tip end, wherein each of the terminal ends is electrically connected to one of the second portions.
  - 50. The microelectronic component of claim 28, wherein the planar leads are curved.
  - 51. The microelectronic component of claim 49, wherein at least one of the tip ends is movable with respect to the first microelectronic element.
  - 52. The microelectronic component of claim 49 further comprising a plurality of joining units, wherein each of the joining units is electrically connected to one of the tip ends.
  - 53. The microelectronic component of claim 52, wherein the joining units are solder balls.
  - 54. The microelectronic component of claim 52, wherein at least one of the joining units is movable with respect to the first microelectronic element.
  - 55. The microelectronic component of claim 25, wherein the first microelectronic element is a semiconductor chip.
  - 56. The microelectronic component of claim 25, wherein the first interposer comprises a material selected from the group consisting of alumina, beryllia, silicon carbide, aluminum nitride, forsterite, mullite, silicon, glass/ceramic composite, polyester/fiberglass composite, polyimide/fiberglass composite, epoxy/fiberglass composite and BT.
  - 57. The microelectronic component of claim 25, wherein the second interposer comprises polyimide.
  - 58. The microelectronic component of claim 25, wherein the first microelectronic element has a first CTE, and further wherein the first interposer has a second CTE that is substantially similar to the first CTE.
  - 59. The microelectronic component of claim 25 further comprises a second microelectronic element having a face surface and a plurality of second contacts exposed at the face surface, wherein each of the second contacts is electrically connected to one of the conductive structures.
  - 60. The microelectronic component of claim 59, wherein the first surface of the first interposer includes a central region and a peripheral region surrounding the central region, further wherein the front surface of the first microelectronic element is disposed over the central region, further wherein the second microelectronic element is disposed over a rear surface of the first microelectronic element, and further wherein the face surface faces away from the first microelectronic element.
  - 61. The microelectronic component of claim 60, wherein the front surface of the first microelectronic element is adjacent to the central region, and further wherein the second microelectronic element is adhered to the rear surface of the first microelectronic element.
  - 62. The microelectronic component of claim 61, wherein each of the first contacts is directly connected to one of the conductive structures, and further wherein each of the second contacts is electrically connected to one of the conductive structures by a wirebond.
  - 63. The microelectronic component of claim 62, wherein some of the conductive structures comprise:
    - a first portion disposed in a first aperture of the first interposer and electrically connected to one of the first contacts, said first portion being disposed in the central region of the first interposer; and
      
      a second portion disposed in a second aperture of the second interposer and electrically connected to one of the planar leads.
  - 64. The microelectronic component of claim 63, wherein said some of the conductive structures include an electrically conductive trace that electrically connects the first portion of the conductive structure to the second portion of said conductive structure.
  - 65. The microelectronic component of claim 64, wherein the first portions comprise a conductive polymer, and further wherein the electrically conductive traces and the second portions comprise a metal.
  - 66. The microelectronic component of claim 64, wherein the first portion comprise solder, and further wherein the electrically conductive traces and the second portions comprise a metal.
  - 67. The microelectronic component of claim 62, wherein some of the conductive structures further comprise an electrically conductive element exposed at the first surface of the first interposer, said electrically conductive element having a bonding terminal exposed in the peripheral region of the first interposer and electrically connected to the wirebond.
  - 68. The microelectronic component of claim 67, wherein said some of the conductive structures comprise a metal.
  - 69. The microelectronic component of claim 59, wherein the second microelectronic element is a semiconductor chip.

70. A method of making a microelectronic component comprising:
- providing a first interposer having first and second surfaces;
  
  providing a second interposer having top and bottom surfaces, wherein the second interposer is more flexible than the first interposer;
  
  providing a layer of a metal on the bottom surface of the second interposer;
  
  juxtaposing the top surface of the second interposer with the second surface of the first interposer;
  
  circuitizing the metal layer so that a plurality of planar leads are formed, wherein each planar lead has a tip end and a terminal end;
  
  forming a plurality of openings, said openings extending through the first and second interposers and exposing the terminal ends of the planar leads; and
  
  disposing an electrically conductive material in the openings.
- View Dependent Claims (71, 72, 73, 74, 75, 76, 77, 78, 79, 80, 81, 82, 83, 84, 85, 86, 87)
- - 71. The method of claim 70 further comprising:
    - providing a microelectronic element having a plurality of contacts on a front surface of the microelectronic element; and
      
      juxtaposing the front surface of the microelectronic element with the first surface of the first interposer such that each of the contacts is electrically connected to one of the terminal ends by the electrically conductive material.
  - 72. The method of claim 70, wherein juxtaposing the second interposer with the first interposer includes:
    - laminating the top surface of the second interposer to the second surface of the first interposer.
  - 73. The method of claim 70, wherein providing the second interposer includes:
    - providing the second interposer having first and second layers of a common dielectric material, said first layer defining the bottom surface, and said second layer defining the top surface and being partially cured.
  - 74. The method of claim 73 further comprising:
    - applying heat to the second interposer so that the second interposer is attached to the first interposer when the second layer of the second interposer is cured.
  - 75. The method of claim 74, wherein applying heat includes:
    - applying heat to the metal layer.
  - 76. The method of claim 70, wherein forming the plurality of openings includes:
    - lasing the first and second interposers to form the plurality of the openings.
  - 77. The method of claim 71, wherein disposing the electrically conductive material includes:
    - stenciling a conductive polymer into the openings.
  - 78. The method of claim 77, stenciling the conductive polymer includes stenciling a conductive adhesive into the openings.
  - 79. The method of claim 71, wherein disposing the electrically conductive material includes:
    - stenciling solder into the openings.
  - 80. The method of claim 79, wherein the microelectronic element juxtaposing step includes:
    - reflowing the solder.
  - 81. The method of claim 71 further comprising:
    - providing a plurality of joining units, wherein each of the joining units is electrically connected to one of the tip ends.
  - 82. The method of claim 81, wherein at least one joining unit is movable with respect to the microelectronic element.
  - 83. The method of claim 70, wherein the planar leads are curved.
  - 84. The method of claim 71, wherein providing the microelectronic element includes providing a semiconductor chip.
  - 85. The method of claim 70, wherein providing the second interposer includes:
    - providing the second interposer having a first layer comprising a first dielectric material that is fully cured and a second layer comprising a second dielectric material that is partially cured, said first layer defining the bottom surface, and said second layer defining the top surface.
  - 86. The method of claim 85 further comprising:
    - applying heat to the second interposer so that the second interposer is attached to the first interposer when the second layer of the second interposer is cured.
  - 87. The method of claim 81, wherein at least one of the joining units is disposed below the microelectronic element.

95. An electronic device comprising:
- a microelectronic element having a front surface and a plurality of contacts exposed at the front surface;
  
  a first interposer having first and second surfaces, said first surface being disposed under the microelectronic element;
  
  a second interposer having top and bottom surfaces, said top surface being disposed under the second surface of the first interposer, wherein the second interposer is more flexible than the first interposer;
  
  a plurality of conductive structures, wherein each of the conductive structures is electrically connected to one of the contacts; and
  
  a plurality of planar leads exposed at the bottom surface of the second interposer, wherein each of the planar leads is electrically connected to one of the conductive structures;
  
  a plurality of joining units disposed at the bottom surface of the second interposer, wherein each of the joining units is electrically connected to one of the planar leads; and
  
  a support substrate having a plurality of electrically conductive contact pads, wherein each of the pads is electrically connected to one of the joining units
- View Dependent Claims (96, 97, 98)
- - 96. The electronic device of claim 95, wherein the support substrate is a printed circuit board.
  - 97. The electronic device of claim 96, wherein the conductive structures extend through the first and second interposers.
  - 98. The microelectronic element of claim 95, wherein at least one of the joining units is disposed below the microelectronic element.

Specification

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Current Assignee
Tessera, Inc. (Adeia Inc.)
Original Assignee
Tessera, Inc. (Adeia Inc.)
Inventors
Fjelstad, Joseph, Myers, John

Granted Patent

US 6,573,609 B2
Time in Patent Office

Days
Field of Search
US Class Current

361/767
CPC Class Codes

H01L 2224/05624   Aluminium [Al] as principal...

H01L 2224/16225   the item being non-metallic...

H01L 2224/16237   the bump connector connecti...

H01L 2224/32225   the item being non-metallic...

H01L 2224/45015   being circular

H01L 2224/45099   Material

H01L 2224/48091   Arched

H01L 2224/48227   connecting the wire to a bo...

H01L 2224/48465   the other connecting portio...

H01L 2224/73204   the bump connector being em...

H01L 2224/73265   Layer and wire connectors

H01L 2224/85399   Material

H01L 23/49816   Spherical bumps on the subs...

H01L 23/4985   Flexible insulating substra...

H01L 24/48   of an individual wire conne...

H01L 2924/00   Indexing scheme for arrange...

H01L 2924/00012   Relevant to the scope of th...

H01L 2924/00014   the subject-matter covered ...

H01L 2924/01078   Platinum [Pt]

H01L 2924/01079   Gold [Au]

H01L 2924/01087 : Francium [Fr]

H01L 2924/09701 : Low temperature co-fired ce...

H01L 2924/14 : Integrated circuits

H01L 2924/1423 : Monolithic Microwave Integr...

H01L 2924/15311 : being a ball array, e.g. BGA

H01L 2924/181 : Encapsulation

H01L 2924/19041 : being a capacitor

H01L 2924/207 : Diameter ranges

H05K 2201/049 : PCB for one component, e.g....

H05K 2201/10234 : Metallic balls solder balls...

H05K 2201/10378 : Interposers

H05K 2201/10977 : Encapsulated connections ap...

H05K 2203/041 : Solder preforms in the shap...

H05K 3/284 : for encapsulating mounted c...

H05K 3/3436 : having an array of bottom c...

H05K 3/4084 : by deforming at least one o...

Y02P 70/50 : Manufacturing or production...

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Microelectronics component with rigid interposer

First Claim

3 Assignments

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Abstract

Citations

98 Claims

Specification

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Microelectronics component with rigid interposer

First Claim

3 Assignments

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Abstract

Citations

98 Claims

Specification

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