Curing light
First Claim
Patent Images
1. A curing light comprising:
- a wand adapted to be grasped by a human hand for use in positioning and manipulating the curing light, a light module attached to said wand, said light module including an elongate heat sink with a proximal end and a distal end, said proximal end being proximate said wand, said elongate heat sink having a longitudinal axis, a mounting platform located at said elongate heat sink distal end, said mounting platform being adapted to have a LED chip module, and an LED chip module mounted on said mounting platform, said LED chip module including a primary heat sink, said primary heat sink having a smaller mass than said elongate heat sink, a well on said primary heat sink for mounting an LED chip, an LED chip mounted in said well, a cover that provides protective covering for said LED chip and which permits light emitted by said LED chip to pass through it to provide usable light exiting from said light module.
1 Assignment
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Accused Products
Abstract
A curing light system useful for curing light activated composite materials is disclosed. Various configurations of light emitting semiconductor chips and heat sinks are disclosed, as well as various structures and methods for driving, controlling and using them.
25 Citations
23 Claims
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1. A curing light comprising:
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a wand adapted to be grasped by a human hand for use in positioning and manipulating the curing light, a light module attached to said wand, said light module including an elongate heat sink with a proximal end and a distal end, said proximal end being proximate said wand, said elongate heat sink having a longitudinal axis, a mounting platform located at said elongate heat sink distal end, said mounting platform being adapted to have a LED chip module, and an LED chip module mounted on said mounting platform, said LED chip module including a primary heat sink, said primary heat sink having a smaller mass than said elongate heat sink, a well on said primary heat sink for mounting an LED chip, an LED chip mounted in said well, a cover that provides protective covering for said LED chip and which permits light emitted by said LED chip to pass through it to provide usable light exiting from said light module. - View Dependent Claims (2, 3)
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4. A curing light comprising:
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an elongate heat sink with a proximal end and a distal end, said elongate heat sink having a longitudinal axis defined between said proximal end and said distal end, an LED chip module mounted at said elongate heat sink distal end. said LED chip module including a primary heat sink, said primary heat sink having a smaller mass than said elongate heat sink, a well on said primary heat sink for mounting an LED chip, an LED chip mounted in said well, a cover that provides protective covering for said LED chip and which permits light emitted by said LED chip to pass through it to provide usable light exiting from said light module. - View Dependent Claims (5, 6, 7, 8)
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9. A curing light comprising:
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a secondary heat sink, a semiconductor chip module affixed to said secondary heat sink, said semiconductor chip module including a primary heat sink, a semiconductor chip capable of emitting a light useful for curing composite materials mounted to said primary heat sink, and a cover that provides protective covering for said semiconductor chip and which permits light emitted by said semiconductor chip to pass through it to provide light useful for curing composite materials.
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10. A curing light as recited in claim 0 wherein said semiconductor chip is selected from the group consisting of light emitting diode chips, laser chips, light emitting diode chip array, diode laser chips, diode laser chip array, surface emitting laser chips, edge emitting laser chips, and VCSEL chips.
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11. A curing light comprising:
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a wand adapted to be grasped by a human hand, a battery power source located within said wand, electronic control circuitry located within said wand, a light module, said light module including an elongate heat sink with a proximal end and a distal end, said proximal end being proximate said wand, said elongate heat sink having a longitudinal axis, and elongate heat sink being adapted to draw heat away from a semiconductor located at said elongate heat sink distal end, a mounting location located at said elongate heat sink distal end, a semiconductor chip module located at said mounting location, said semiconductor chip module including a primary heat sink mounted to said elongate heat sink at said mounting location, a semiconductor chip capable of emitting light useful for curing light activated composite materials mounted to said primary heat sink, and a cover that provides protective covering for said semiconductor chip and which permits light emitted by said semiconductor chip to pass through it to provide light useful for curing composite materials. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19)
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20. A curing light comprising:
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a wand designed to be grasped by a human hand, controls for initiating and terminating light transmission by the curing light, circuitry in electrical connection with said controls, a power source for powering the curing light, a light module that is part of the curing light, said light module including;
a primary heat sink, a light emitting semiconductor device, mounted to said primary heat sink, and a cover covering said light emitting semiconductor device but permitting light emitted by said light emitting semiconductor device to pass through said cover, - View Dependent Claims (21, 22, 23)
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Specification