Passivation planarization
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Accused Products
Abstract
A pixel cell is formed by locating a first passivation layer over the final layer of metal lines. Subsequently, the uneven, non-uniform passivation layer is subjected to a planarization process such as chemical mechanical polishing, mechanical abrasion, or etching. A spin-on-glass layer may be deposited over the non-uniform passivation layer prior to planarization. Once a uniform, flat first passivation layer is achieved over the final metal, a second passivation layer, a color filter array, or a lens forming layer with uniform thickness is formed over the first passivation layer. The passivation layers can be oxide, nitride, a combination of oxide and nitride, or other suitable materials. The color filter array layer may also undergo a planarization process prior to formation of the lens forming layer. The present invention is also applicable to other devices.
14 Citations
88 Claims
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1-66. -66. (Canceled)
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67. A pixel cell of an imaging device comprising:
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a pixel circuit formed on a substrate;
a metal layer provided over said pixel circuit;
a first layer with a planarized surface provided over an upper horizontal metal layer; and
a second layer with a uniform thickness over said first layer. - View Dependent Claims (68, 69, 70, 71, 72, 73, 74)
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75. A pixel cell of an imaging device comprising:
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a pixel circuit formed on a substrate;
at least one metal layer provided over said pixel circuit;
a planarized passivation layer provided over said metal layer;
a color filter array layer; and
a lens forming layer located over said color filter array layer. - View Dependent Claims (76, 77)
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78. A pixel cell of an imaging device comprising:
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a pixel circuit formed on a substrate;
a metal layer provided over said pixel circuit;
a first passivation layer provided over said metal layer;
a spin-on-glass layer provided over said first passivation layer; and
a planarized second layer provided over said spin-on-glass layer. - View Dependent Claims (79, 80, 81, 82, 83)
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84. A pixel cell of an imaging device comprising:
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a pixel circuit formed on a substrate;
a metal layer provided over said pixel circuit;
a first passivation layer provided over said metal layer, a bottom surface of said first passivation layer being entirely above a top surface of said metal layer; and
a planarized second layer provided over said first passivation layer. - View Dependent Claims (85, 86, 87, 88)
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Specification