Thermal solution for electronic devices
First Claim
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1. A thermal dissipation and shielding system for an electronic device, comprising:
- an electronic device comprising a first component which comprises a heat source, wherein the first component transmits heat to an external surface of the electronic component;
a thermal solution comprising two major surfaces, the thermal solution positioned such that one of its major surfaces is in operative contact with the first component such that it is interposed between the first component and the external surface of the electronic component to which the first component transmits heat, wherein the thermal solution comprises at least one sheet of flexible graphite.
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Abstract
A thermal solution for an electronic device, which is positioned between a heat source and an external surface of the electronic device and/or another component of the electronic device, where the thermal solution facilitates heat dissipation from the heat source while shielding the external surface and/or second component from the heat generated by the heat source.
62 Citations
20 Claims
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1. A thermal dissipation and shielding system for an electronic device, comprising:
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an electronic device comprising a first component which comprises a heat source, wherein the first component transmits heat to an external surface of the electronic component;
a thermal solution comprising two major surfaces, the thermal solution positioned such that one of its major surfaces is in operative contact with the first component such that it is interposed between the first component and the external surface of the electronic component to which the first component transmits heat, wherein the thermal solution comprises at least one sheet of flexible graphite. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A thermal dissipation and shielding system for an electronic device, comprising:
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an electronic device comprising a first component which comprises a heat source and a second component to which the first component transmits heat;
a thermal solution comprising two major surfaces, the thermal solution positioned such that one of its major surfaces is in operative contact with the first component such that it is interposed between the first component and the second component, wherein the thermal solution comprises at least one sheet of flexible graphite. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification
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Current AssigneeNeoGraf Solutions, LLC
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Original AssigneeAdvanced Energy Technology Inc. (Graftech International Limited)
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InventorsReynolds, Robert Anderson III, Smalc, Martin David, Shives, Gary D.
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Granted Patent
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Time in Patent OfficeDays
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Field of Search
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US Class Current361/700
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CPC Class CodesG06F 1/182 with special features, e.g....G06F 1/203 for portable computers, e.g...H01L 23/373 Cooling facilitated by sele...H01L 23/552 Protection against radiatio...H01L 2924/00 Indexing scheme for arrange...H01L 2924/0002 Not covered by any one of g...H01L 2924/09701 Low temperature co-fired ce...
