Microelectronic component with rigid interposer
DC
First Claim
Patent Images
1. A connection component comprising:
- a first interposer having first and second surfaces;
a second interposer having top and bottom surfaces, said top surface being disposed under said second surface, wherein the second interposer is more flexible than the first interposer;
a plurality of conductive structures exposed at the first surface of the first interposer; and
a plurality of planar leads exposed at the bottom surface of the second interposer, wherein each of the planar leads is electrically connected to at least one of the conductive structures.
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Abstract
A connection component is provided. The connection component includes (1) a first interposer having a first surface to which a microelectronic may be mounted and a second surface opposite from the first surface, (2) a second interposer that is more flexible than the first interposer and that is disposed under the second surface of the rigid interposer, and (3) a plurality of conductive parts that may be positioned in the first and second interposers and that may be exposed at the first surface of the first interposer, a bottom surface of the second interposer, or both the first and bottom surfaces. The electrically conductive parts may include leads. A socket assembly or a microelectronic element such as semiconductor chip may be mounted onto the first surface of the rigid interposer. The connection component may be mounted onto a support substrate.
75 Citations
73 Claims
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1. A connection component comprising:
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a first interposer having first and second surfaces;
a second interposer having top and bottom surfaces, said top surface being disposed under said second surface, wherein the second interposer is more flexible than the first interposer;
a plurality of conductive structures exposed at the first surface of the first interposer; and
a plurality of planar leads exposed at the bottom surface of the second interposer, wherein each of the planar leads is electrically connected to at least one of the conductive structures. - View Dependent Claims (2, 3, 4, 5)
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6. A connection component comprising:
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a first interposer having first and second surfaces;
a second interposer having top and bottom surfaces, said top surface being disposed under said second surface, wherein the second interposer is more flexible than the first interposer;
a plurality of conductive structures exposed at the first surface of the first interposer; and
a plurality of planar leads exposed at the bottom surface of the second interposer, wherein each of the planar leads is electrically connected to at least one of the conductive structures;
said top surface being adjacent to said second surface;
at east one of the conductive structures including a first portion that extends through the first interposer and a second portion that extends through the second interposer;
each of he conductive structures including a first portion that extend through the first interposer and a second portion that extends through the second interposer. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13)
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14. A connection component comprising:
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a first interposer having first and second surfaces;
a second interposer having top and bottom surfaces, said top surface being disposed under said second surface, wherein the second interposer is more flexible than the first interposer;
a plurality of conductive structures exposed at the first surface of the first interposer;
a plurality of planar leads exposed at the bottom surface of the second interposer, wherein each of the planar leads is electrically connected to at least one of the conductive structures; and
further comprising;
a third interposer; and
a fourth interposer, wherein the third interposer is disposed over the top surface of the second interposer and the fourth interposer, further wherein the fourth interposer is disposed over the third interposer, further wherein the second surface of the first interposer is disposed over the fourth interposer, and further wherein the second and fourth interposers are more flexible than the first and third interposers. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21)
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22. A connection component comprising:
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a first interposer having first and second surfaces;
a second interposer having top and bottom surfaces, said top surface being disposed under said second surface, wherein the second interposer is more flexible than the first interposer;
a plurality of conductive structures exposed at the first surface of the first interposer; and
a plurality of planar leads exposed at the bottom surface of the second interposer, wherein each of the planar leads is electrically connected to at least one of the conductive structure;
the first interposer comprising a material selected from the group consisting of alumina, beryllia, silicon carbide, aluminum nitride, forsterite, mullite, silicon, glass/ceramic composite, polyester /fiberglass composite, polyimide/fiberglass composite, epoxy/fiberglass composite and BT.
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23. A connection component comprising:
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a first interposer having first and second surfaces;
a second interposer having top and bottom surfaces, said top surface being disposed under said second surface, wherein the second interposer is more flexible than the first interposer;
a plurality of conductive structures exposed at the first surface of the first interposer; and
a plurality of planar leads exposed at the bottom surface of the second interposer, wherein each of the planar leads is electrically connected to at least one of the conductive structures;
the second interposer comprising polyimide.
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24. A connection component comprising:
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a first interposer having first and second surfaces;
a second interposer having top and bottom surfaces, said top surface being disposed under the second surface of the first interposer, wherein the second interposer is more flexible than the first interposer; and
a plurality of conductive structures, said conductive structures extending through the first and the second interposers, wherein the conductive structures are exposed at the first surface of the first interposer.
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25. A microelectronic component comprising:
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a first microelectronic element having a front surface and a plurality of first contacts exposed at the front surface;
a first interposer having first and second surfaces, said first surface being disposed under the first microelectronic element;
a second interposer having top and bottom surfaces, said top surface being disposed under the second surface of the first interposer, wherein the second interposer is more flexible than the first interposer;
a plurality of conductive structures, wherein each of the conductive structures is electrically connected to one of the first contacts; and
a plurality of planar leads exposed at the bottom surface of the second interposer, wherein each of the planar leads is electrically connected to one of the conductive structures. - View Dependent Claims (26, 27)
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28. A microelectronic component comprising:
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a first microelectronic element having a front surface and a plurality of first contacts exposed at the front surface;
a first interposer having first and second surfaces, said first surface being disposed under the first microelectronic element;
a second interposer having top and bottom surfaces, said top surface being disposed under the second surface of the first interposer, wherein the second interposer is more flexible than the first interposer;
a plurality of conductive structures, wherein each of the conductive structures is electrically connected to one of the first contacts; and
a plurality of planar leads exposed at the bottom surface of the second interposer, wherein each of the planar leads is electrically connected to one of the conductive structures;
the second surface of the first interposer being adjacent to the top surface of the second interposer;
the first surface of the first interposer being adjacent to the front surface of the first microelectronic element; and
wherein each of the conductive structures comprises;
a first portion disposed in a first aperture of the first interposer an electrically connected to one of the first contacts; and
a second portion disposed in a second aperture of the second interposer and electrically connected to one of the planar leads. - View Dependent Claims (29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 50)
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40. A microelectronic component comprising:
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a first microelectronic element having a front surface and a plurality of first contacts exposed at the front surface;
a first interposer having first and second surfaces, said first surface being disposed under the first microelectronic element;
a second interposer having top and bottom surfaces, said top surface being disposed under the second surface of the first interposer, wherein the second interposer is more flexible than the first interposer;
a plurality of conductive structures, wherein each of the conductive structures is electrically connected to one of the first contacts; and
a plurality of planar leads exposed at the bottom surface of the second interposer, wherein each of the planar leads is electrically connected to one of the conductive structures;
the second surface of the first interposer being adjacent to the top surface of the second interposer;
the first surface of the first interposer including a central region and peripheral region surrounding the central region, further wherein the first microelectronic element is disposed over the central region, and further wherein the front surface of the first microelectronic element faces away from the first surface of the first interposer. - View Dependent Claims (41, 42, 43, 44, 45, 46, 47, 48, 49, 51, 52, 53, 54)
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55. A microelectronic component comprising:
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a first microelectronic element having a front surface and a plurality of first contacts exposed at the front surface;
a first interposer having first and second surfaces, said first surface being disposed under the first microelectronic element;
a second interposer having top and bottom surfaces, said top surface being disposed under the second surface of the first interposer, wherein the second interposer is more flexible than the first interposer;
a plurality of conductive structures, wherein each of the conductive structures is electrically connected to one of the first contacts; and
a plurality of planar leads exposed at the bottom surface of the second interposer, wherein each of the planar leads is electrically connected to one of the conductive structures;
the first microelectronic element being a semiconductor chip.
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56. A microelectronic component comprising:
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a first microelectronic element having a front surface and a plurality of first contacts exposed at the front surface;
a first interposer having first and second surfaces, said first surface being disposed under the first microelectronic element;
a second interposer having top and bottom surfaces, said top surface being disposed under the second surface of the first interposer, wherein the second interposer is more flexible than the first interposer;
a plurality of conductive structures, wherein each of the conductive structures is electrically connected to one of the first contacts; and
a plurality of planar leads exposed at the bottom surface of the second interposer, wherein each of the planar leads is electrically connected to one of the conductive structures;
the first interposer comprising a material selected from the group consisting of alumina, beryllia, silicon carbide, aluminum nitride, forsterite, mullite, silicon, glass/ceramic composite, polyester/fiberglass composite, polyimide/fiberglass composite, epoxy/fiberglass composite and BT.
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57. A microelectronic component comprising:
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a first microelectronic element having a front surface and a plurality of first contacts exposed at the front surface;
a first interposer having first and second surfaces, said first surface being disposed under the first microelectronic element;
a second interposer having top and bottom surfaces, said top surface being disposed under the second surface of the first interposer, wherein the second interposer is more flexible than the first interposer;
a plurality of conductive structures, wherein each of the conductive structures is electrically connected to one of the first contacts; and
a plurality of planar leads exposed at the bottom surface of the second interposer, wherein each of the planar leads is electrically connected to one of the conductive structures;
the second interposer comprising polyimide.
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58. A microelectronic component comprising:
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a first microelectronic element having a front surface and a plurality of first contacts exposed at the front surface;
a first interposer having first and second surfaces, said first surface being disposed under the first microelectronic element;
a second interposer having top and bottom surfaces, said top surface being disposed under the second surface of the first interposer, wherein the second interposer is more flexible than the first interposer;
a plurality of conductive structures, wherein each of the conductive structures is electrically connected to one of the first contacts; and
a plurality of planar leads exposed at the bottom surface of the second interposer, wherein each of the planar leads is electrically connected to one of the conductive structures;
the first microelectronic element having a first CTE, and further wherein the first interposer has a second CTE that is substantially similar to the first CTE.
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59. A microelectronic component comprising:
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a first microelectronic element having a front surface and a plurality of first contacts exposed at the front surface;
a first interposer having first and second surfaces, said first surface being disposed under the first microelectronic element;
a second interposer having top and bottom surfaces, said top surface being disposed under the second surface of the first interposer, wherein the second interposer is more flexible than the first interposer;
a plurality of conductive structures, wherein each of the conductive structures is electrically connected to one of the first contacts;
a plurality of planar leads exposed at the bottom surface of the second interposer, wherein each of the planar leads is electrically connected to one of the conductive structures; and
a second microelectronic element having a face surface and a plurality of second contacts exposed at the face surface, wherein each of the second contacts is electrically connected to one of the conductive structures. - View Dependent Claims (60, 61, 62, 63, 64, 65, 66, 67, 68, 69)
a first portion disposed in a first aperture of the first interposer and electrically connected to one of the first contacts, said first portion being disposed in the central region of the first interposer; and
a second portion disposed in a second aperture of the second interposer and electrically connected to one of the planar leads.
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65. The microelectronic component of claim 64, wherein said some of the conductive structures include an electrically conductive trace that electrically connects the first portion of the conductive structure to the second portion of said conductive structure.
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66. The microelectronic component of claim 65, wherein the first portions comprise a conductive polymer, and further wherein the electrically conductive traces and the second portions comprise a metal.
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67. The microelectronic component of claim 65, wherein the first portion comprise solder, and further wherein the electrically conductive traces and the second portions comprise a metal.
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68. The microelectronic component of claim 63, wherein some of the conductive structures further comprise an electrically conductive element exposed at the first surface of the first interposer, said electrically conductive element having a bonding terminal exposed in the peripheral region of the first interposer and electrically connected to the wirebond.
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69. The microelectronic component of claim 68, wherein said some of the conductive structures comprise a metal.
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70. An electronic device comprising:
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a microelectronic element having a front surface and a plurality of contacts exposed at the front surface;
a first interposer having first and second surfaces, said first surface being disposed under the microelectronic element;
a second interposer having top and bottom surfaces, said top surface being disposed under the second surface of the first interposer, wherein the second interposer is more flexible than the first interposer;
a plurality of conductive structures, wherein each of the conductive structures is electrically connected to one of the contacts; and
a plurality of planar leads exposed at the bottom surface of the second interposer, wherein each of the planar leads is electrically connected to one of the conductive structures;
a plurality of joining units disposed at the bottom surface of the second interposer, wherein each of the joining units is electrically connected to one of the planar leads; and
a support substrate having a plurality of electrically conductive contact pads, wherein each of the pads is electrically connected to one of the joining units. - View Dependent Claims (71, 72, 73)
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Specification
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Litigation Data
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Current AssigneeTessera, Inc. (Adeia Inc.)
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Original AssigneeTessera, Inc. (Adeia Inc.)
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InventorsFjelstad, Joseph, Myers, John
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Primary Examiner(s)CLARK, JASMINE JHIHAN B
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Application NumberUS09/771,412Publication NumberTime in Patent Office858 DaysField of Search257/693, 257/696, 257/778, 257/780, 257/789, 257/686, 439/66, 439/67, 439/77, 439/78US Class Current257/778CPC Class CodesH01L 2224/05624 Aluminium [Al] as principal...H01L 2224/16225 the item being non-metallic...H01L 2224/16237 the bump connector connecti...H01L 2224/32225 the item being non-metallic...H01L 2224/45015 being circularH01L 2224/45099 MaterialH01L 2224/48091 ArchedH01L 2224/48227 connecting the wire to a bo...H01L 2224/48465 the other connecting portio...H01L 2224/73204 the bump connector being em...H01L 2224/73265 Layer and wire connectorsH01L 2224/85399 MaterialH01L 23/49816 Spherical bumps on the subs...H01L 23/4985 Flexible insulating substra...H01L 24/48 of an individual wire conne...H01L 2924/00 Indexing scheme for arrange...H01L 2924/00012 Relevant to the scope of th...H01L 2924/00014 the subject-matter covered ...H01L 2924/01078 Platinum [Pt]H01L 2924/01079 Gold [Au]View All
