ELECTRICAL DEVICE WITH TEETH JOINING LAYERS AND METHOD FOR MAKING THE SAME
9 Assignments
0 Petitions
Accused Products
Abstract
A multilayer electrical device, such as a printed circuit board, having a tooth structure including a metal layer set in a dielectric. The device includes a base; a conductive layer adjacent to the base; a dielectric material adjacent to conductive layer; a tooth structure including a metal layer set in the dielectric material to join the dielectric material to the metal layer; and wherein the metal layer forms a portion of circuitry.
2 Citations
33 Claims
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1. (canceled)
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2. A process of making an article of manufacture, the process comprising:
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implementing a circuit design for an electrical device by coupling a dielectric material delivered with solid content sufficient that etching the dielectric material forms a non-uniformly roughened surface of cavities located in, and underneath an initial surface of, the dielectric material, sufficient that the etching of the dielectric material uses non-homogeneity with the solid content in bringing about formation of the non-uniformly roughened surface of the cavities and sufficient that the etching of the dielectric material is such that a plurality of the cavities have a cross-sectional width that is greater than a maximum depth with respect to the initial surface, wherein the etching forms the non-uniformly roughened surface of cavities, with a conductive material, a portion of the conductive material in the cavities thereby forming numerous sized and shaped teeth in the cavities, in circuitry of the electrical device. - View Dependent Claims (6, 10, 14, 18, 22, 26, 30)
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3. A process of making an article of manufacture, the process comprising:
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implementing a circuit design for an electrical device by coupling a dielectric material delivered with solid content sufficient that etching the dielectric material forms a non-uniformly roughened surface comprising cavities located in, and underneath a surface of, the dielectric material, and sufficient that the etching of the dielectric material uses non-homogeneity with the solid content in bringing about formation of the non-uniformly roughened surface with at least some of the cavities having a first cross-sectional distance proximate the surface and a greater cross-sectional distance distant from the surface, with a conductive material, whereby the etching of the dielectric material forms the cavities, and a portion of the conductive material in the cavities thereby forming teeth in the cavities, wherein the etching of the non-homogeneous composition forms the cavities, in circuitry of the electrical device. - View Dependent Claims (7, 11, 15, 19, 23, 27, 31)
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4. A process of making an article of manufacture, the process comprising:
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implementing a circuit design for an electrical device by coupling a dielectric material delivered with sufficient solid content that etching of the dielectric material forms a non-uniformly roughened surface of cavities located in, and underneath an initial surface of, the dielectric material and sufficient that the etching of the dielectric material uses the non-homogeneity with the solid content in bringing about formation of the non-uniformly roughened surface of the cavities, and the cavities have a cross-sectional distance proximate the initial surface and a greater cross-sectional distance distant from the initial surface, and a conductive material, a portion of the conductive material in the cavities thereby forming teeth in the cavities, wherein the etching of the dielectric material forms the cavities so that a plurality of the teeth each expand below a respective narrower region which is closer to the initial surface, in circuitry of the electrical device. - View Dependent Claims (8, 12, 16, 20, 24, 28, 32)
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5. A process of making an article of manufacture, the process comprising:
implementing a circuit design for an electrical device with circuitry comprising interlocking a conductor part of the circuitry configured to fill cavities in a dielectric material disposed in combination with the circuitry and coupled with the conductor part in a configuration where the dielectric material comprises a non-uniformly roughened surface comprising said cavities which are located in and underneath an initial surface of the dielectric material that is delivered with solid content being non-homogeneous and configured to bring about formation of the non-uniformly roughened surface by etching of the dielectric material, at least some the cavities having a first cross-sectional distance proximate the initial surface and a greater cross-sectional distance distant from the initial surface. - View Dependent Claims (9, 13, 17, 21, 25, 29, 33)
Specification