Electrical device with teeth joining layers and method for making the same
DC CAFC
First Claim
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1. A process of making an article of manufacture, the process comprising:
- implementing a circuit design for an electrical device by coupling a dielectric material delivered with solid content, the dielectric material and the solid content being non-homogeneous materials, sufficient that etching the dielectric material forms a non-uniformly roughened surface of cavities located in, and underneath an initial surface of, the dielectric material, sufficient that the etching of the dielectric material uses non-homogeneity with the solid content in bringing about formation of the non-uniformly roughened surface of the cavities and sufficient that the etching of the dielectric material is such that a plurality of the cavities have a cross-sectional width that is greater than a maximum depth with respect to the initial surface, wherein the etching forms the non-uniformly roughened surface of cavities, witha conductive material, a portion of the conductive material in the cavities thereby forming numerous sized and shaped teeth in the cavities, in circuitry of the electrical device.
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Abstract
A multilayer electrical device, such as a printed circuit board, having a tooth structure including a metal layer set in a dielectric. The device includes a base; a conductive layer adjacent to the base; a dielectric material adjacent to conductive layer; a tooth structure including a metal layer set in the dielectric material to join the dielectric material to the metal layer; and wherein the metal layer forms a portion of circuitry.
76 Citations
48 Claims
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1. A process of making an article of manufacture, the process comprising:
implementing a circuit design for an electrical device by coupling a dielectric material delivered with solid content, the dielectric material and the solid content being non-homogeneous materials, sufficient that etching the dielectric material forms a non-uniformly roughened surface of cavities located in, and underneath an initial surface of, the dielectric material, sufficient that the etching of the dielectric material uses non-homogeneity with the solid content in bringing about formation of the non-uniformly roughened surface of the cavities and sufficient that the etching of the dielectric material is such that a plurality of the cavities have a cross-sectional width that is greater than a maximum depth with respect to the initial surface, wherein the etching forms the non-uniformly roughened surface of cavities, with a conductive material, a portion of the conductive material in the cavities thereby forming numerous sized and shaped teeth in the cavities, in circuitry of the electrical device. - View Dependent Claims (5, 9, 13, 17, 21, 25, 29)
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2. A process of making an article of manufacture, the process comprising:
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implementing a circuit design for an electrical device by coupling a dielectric material delivered with solid content, the dielectric material and the solid content being non-homogeneous materials, sufficient that etching the dielectric material forms a non-uniformly roughened surface comprising cavities located in, and underneath a surface of, the dielectric material, and sufficient that the etching of the dielectric material uses non-homogeneity with the solid content in bringing about formation of the non-uniformly roughened surface with at least some of the cavities having a first cross-sectional distance proximate the surface and a greater cross-sectional distance distant from the surface, with a conductive material, whereby the etching of the dielectric material forms the cavities, and a portion of the conductive material in the cavities thereby forming teeth in the cavities, wherein the etching of the non-homogeneous composition forms the cavities, in circuitry of the electrical device. - View Dependent Claims (6, 10, 14, 18, 22, 26, 30)
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3. A process of making an article of manufacture, the process comprising:
implementing a circuit design for an electrical device by coupling a dielectric material delivered with sufficient solid content, the dielectric material and the solid content being non-homogeneous materials, that etching of the dielectric material forms a non-uniformly roughened surface of cavities located in, and underneath an initial surface of, the dielectric material and sufficient that the etching of the dielectric material uses non-homogeneity with the solid content in bringing about formation of the non-uniformly roughened surface of the cavities, and the cavities have a cross-sectional distance proximate the initial surface and a greater cross-sectional distance distant from the initial surface, and a conductive material, a portion of the conductive material in the cavities thereby forming teeth in the cavities, wherein the etching of the dielectric material forms the cavities so that a plurality of the teeth each expand below a respective narrower region which is closer to the initial surface, in circuitry of the electrical device. - View Dependent Claims (7, 11, 15, 19, 23, 27, 31)
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4. A process of making an article of manufacture, the process comprising:
implementing a circuit design for an electrical device with circuitry comprising interlocking a conductor part of the circuitry configured to fill cavities in a dielectric material disposed in combination with the circuitry and coupled with the conductor part in a configuration where the dielectric material comprises a non-uniformly roughened surface comprising said cavities which are located in and underneath an initial surface of the dielectric material that is delivered with solid content, the dielectric material and the solid content being non-homogeneous materials, configured to bring about formation of the non-uniformly roughened surface by etching of the dielectric material, at least some the cavities having a first cross-sectional distance proximate the initial surface and a greater cross-sectional distance distant from the initial surface. - View Dependent Claims (8, 12, 16, 20, 24, 28, 32)
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33. A process of making an article of manufacture, the process comprising:
implementing a circuit design for an electrical device with circuitry comprising interlocking a conductor part of the circuitry configured to fill cavities in a dielectric material disposed in combination with the circuitry and coupled with the conductor part in a configuration where the dielectric material comprises a non-uniformly roughened surface comprising said cavities which are located in and underneath an initial surface of the dielectric material that is delivered with solid content, the dielectric material and the solid content being non-homogeneous materials, to bring about formation of the non-uniformly roughened surface by etching of the dielectric material, at least some the cavities having a first cross-sectional distance proximate the initial surface and a greater cross-sectional distance distant from the initial surface. - View Dependent Claims (34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48)
Specification
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Litigation Data
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Current AssigneeContinental Circuits LLC (Chicago Harbor Innovation Producers, LLC)
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Original AssigneeContinental Circuits LLC (Chicago Harbor Innovation Producers, LLC)
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InventorsMcDermott, Brian J., McGowan, Daniel, Spotts, Jr., Ralph Leo, Tryzbiak, Sid
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Primary Examiner(s)Willis, Tremesha S
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Application NumberUS14/048,592Publication NumberTime in Patent Office987 DaysField of Search174255-262, 174/264, 174/266, 298/29, 298/31, 216/13, 216 16- 18, 205/125US Class Current1/1CPC Class CodesH05K 1/0296 Conductive pattern lay-out ...H05K 1/032 consisting of one materialH05K 2203/0796 Oxidant in aqueous solution...H05K 3/0017 Etching of the substrate by...H05K 3/0023 by exposure and development...H05K 3/0055 After-treatment, e.g. clean...H05K 3/10 in which conductive materia...H05K 3/381 by special treatment of the...H05K 3/4661 Adding a circuit layer by d...Y10T 29/49117 Conductor or circuit manufa...Y10T 29/49126 Assembling basesY10T 29/49155 Manufacturing circuit on or...Y10T 29/49165 by forming conductive walle...Y10T 428/12361 having aperture or cutY10T 428/24331 including nonapertured comp...
