Method of identifying specific holes in an interface guiding plate
DC CAFC
First Claim
1. A method of identifying specific holes in a board interface guiding plate having a surface of first predetermined surface color, said plate intended to receive contact pins to pass through said specific holes, the method comprising:
- a) firmly adhering an indicator colorant of a second predetermined color to said surface at least surrounding each of said holes;
b) removing the indicator colorant generally circumferentially around selected holes which are to be left populated or conversely unpopulated with pins, so that holes can be distinguished from each other;
c) populating as a group either the selected or unselected holes with pins; and
d) visually verifying that holes which are to be populated with pins are present in the appropriate holes and absent in all others as determined by the presence or absence of colorant.
3 Assignments
Litigations
0 Petitions
Accused Products
Abstract
A circuit board tester that uses a dual-stage translation to bring a unit under test (UUT) into physical and electric contact first with a series of tall probes, then with a series of short probes. Initially, the UUT is mounted on a support plate, and spaced apart from both the tall and short probes. First, in order to perform a functional test on the UUT, a first vacuum stage is engaged, and atmospheric pressure translates the UUT longitudinally until contact is made with a first hard stop, defining a first position. At this first position, the UUT is in contact with a series of tall probes, and is spaced apart from a series of short probes. After a function test is performed, a second vacuum stage is engaged in addition to, and independent of, the first vacuum stage. Atmospheric pressure translates the UUT longitudinally until contact is made with a second hard stop, defining a second position.
6 Citations
14 Claims
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1. A method of identifying specific holes in a board interface guiding plate having a surface of first predetermined surface color, said plate intended to receive contact pins to pass through said specific holes, the method comprising:
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a) firmly adhering an indicator colorant of a second predetermined color to said surface at least surrounding each of said holes; b) removing the indicator colorant generally circumferentially around selected holes which are to be left populated or conversely unpopulated with pins, so that holes can be distinguished from each other; c) populating as a group either the selected or unselected holes with pins; and d) visually verifying that holes which are to be populated with pins are present in the appropriate holes and absent in all others as determined by the presence or absence of colorant. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of identifying specific holes in a non circuit board interface guiding plate having a surface of first predetermined surface color, said plate intended to receive contact pins to pass through specific holes, the method comprising:
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a) forming a plurality of holes in the interface plate to form a matrix of columns and rows of holes; b) overcoating said surface with a coating having a second predetermined surface color, said overcoating second color being different from said plate surface color; c) determining which of the holes in the matrix are to be identified for populating with said contact pins; and d) removing said overcoating around such holes as are determined to be populated;
so that visual inspection of the plate will easily identify holes intended to be populated by the lack of overcoating adjacent said holes. - View Dependent Claims (9, 10, 11, 12, 13)
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14. A method of preparing a board interface guiding plate for using in a circuit testing device, said plate having a matrix of holes in rows and columns to be located in a circuit board testing device, some of the holes to be populated by probes which will extend through the holes and engage an electronic circuit board when the board and probes are brought together by the testing device, said plate having a surface of first predetermined surface color, said plate intended to receive contact pins in specific holes, the method comprising:
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a) forming a plurality of holes in the interface plate to form a matrix of columns and rows of holes; b) overcoating said surface with a coating having a second predetermined surface color, said overcoating second color being different from said plate surface color; c) determining which of the holes in the matrix are to be identified for populating with said contact pins; and d) removing said overcoating around such holes as are determined to be populated;
so that visual inspection of the plate will easily identify holes intended to be populated by the lack of overcoating adjacent said holes.
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Specification
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- Resources
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Current AssigneeCircuit Check
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Original AssigneeCircuit Check
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InventorsAdams, Neil, Eickhoff, Stuart, Hample, Jon
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Primary Examiner(s)Kornakov; Michael
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Assistant Examiner(s)ZHAO, XIAO SI
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Application NumberUS11/732,087Publication NumberTime in Patent Office1,107 DaysField of Search427/271, 439/92, 439/101, 439/108, 439/608, 439/931US Class Current427/271CPC Class CodesG01R 31/2808 Holding, conveying or conta...Y10S 439/931 Conductive coating
